ISIG Executive Summit 2026 to bring global semiconductor leaders to New Delhi

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NEW DELHI: The International Semiconductor Industry Group (ISIG) will host the ISIG Executive Summit India 2026 on November 3-4 at The LaLiT, New Delhi, bringing together global semiconductor industry leaders, technology executives, researchers, investors and government representatives to explore opportunities in India's growing semiconductor ecosystem.

The two-day summit will be held under the theme 'Enabling the Intelligent Future: Advanced Semiconductors, AI, Data Centers and Power Electronics'. The discussions will focus on advanced semiconductor packaging, chip manufacturing, artificial intelligence (AI) infrastructure, photonics, power electronics, wide-bandgap technologies and global supply-chain development.

The event is expected to feature participation from leading international organisations, including UCLA, Georgia Institute of Technology, imec, Infineon, Mitsubishi Electric, Renesas, Nexperia, Navitas, Marvell, Sandisk, GlobalFoundries, Yole Group and AT&S. Indian industry representatives and government stakeholders will also participate, including the India Semiconductor Mission (ISM), Semiconductor Laboratory (SCL), state government representatives from Madhya Pradesh and Tamil Nadu, and Invest India.

The summit comes amid growing investment and policy support for India's semiconductor ambitions. According to the Ministry of Electronics and Information Technology (MeitY), 12 semiconductor manufacturing units had been approved across the country as of July 2026, with cumulative investment commitments exceeding Rs 1.64 lakh crore. These projects cover silicon and compound semiconductor fabrication, display manufacturing and advanced packaging.

Further strengthening the sector, the Union Cabinet approved the next phase of the Semicon India Programme, Semicon 2.0, on July 15, 2026, with a proposed outlay of Rs 1,27,500 crore. The programme aims to expand domestic capabilities in chip design, semiconductor manufacturing, advanced packaging, research and development, equipment, materials and talent development.

India's semiconductor design capabilities are another major area of opportunity. The country accounts for nearly 20 per cent of the global semiconductor chip-design workforce, positioning it as an important destination for research, design and engineering activities.

Against this backdrop, the summit will examine opportunities across advanced packaging, Outsourced Semiconductor Assembly and Test (OSAT), power electronics, chip design, semiconductor materials and equipment. The growing demand for AI applications and data centres is also creating new requirements for memory, connectivity, power management and advanced packaging technologies.

Wide-bandgap semiconductors, particularly Silicon Carbide (SiC) and Gallium Nitride (GaN), are expected to feature prominently in discussions, given their increasing applications in electric mobility, renewable energy and industrial systems.

Salah Nasri, CEO and Co-Founder of ISIG, said India had become an important part of the global semiconductor industry, adding that the focus should now be on building meaningful capabilities and strengthening the country's contribution to the international value chain. He said the summit aims to bring global industry leaders, policymakers and investors together to develop partnerships and support long-term growth.

Santosh Kumar, President, ISIG India, and CEO of Paras Semiconductors, said India had significant opportunities in advanced packaging, OSAT and power electronics. He emphasised the need to strengthen domestic capabilities and supply chains while enabling Indian companies to move towards higher value addition.

Dr Shalu Agarwal, General Manager of India and Head of Power Semiconductor at ISIG, highlighted the growing importance of power electronics in electric mobility, renewable energy, industrial applications and AI data centres. She said India had considerable potential in SiC and GaN technologies, making investments in design, packaging, testing and reliability capabilities essential.

The ISIG Executive Summit India 2026 is part of the organisation's global summit series for 2026, aimed at connecting semiconductor industry stakeholders across major international markets. ISIG has also announced that its next India edition will be held on November 30 and December 1, 2027.